Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
612-822-4611

  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
3D Microelectronic Packaging: From Architectures to Applications

3D Microelectronic Packaging: From Architectures to Applications

Goyal, Deepak
Li, Yan

Hardcover

Series: Springer Advanced Microelectronics, Book 64

Technology & EngineeringBiology

ISBN10: 9811570892
ISBN13: 9789811570896
Publisher: Springer Nature
Published: Nov 24 2020
Pages: 622
Weight: 2.35
Height: 1.38 Width: 6.14 Depth: 9.21
Language: English

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Also in

Technology & Engineering

View All