Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Electronic Packaging for High Reliability, Low Cost Electronics

Electronic Packaging for High Reliability, Low Cost Electronics

Tummala, R. R.
Kosec, Marija
Jones, W. K.

Hardcover

Series: NATO Science Partnership Subseries: 3, Book 57

Technology & Engineering

ISBN10: 0792352181
ISBN13: 9780792352181
Publisher: Springer Nature
Published: Feb 29 2000
Pages: 296
Weight: 1.35
Height: 0.75 Width: 6.14 Depth: 9.21
Language: English
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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