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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863

Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863

Besser, Paul R.
Besser, P. R.
Iacopi, F.

Hardcover

Series: Materials Research Society Symposium Proceedings (Hardcover), Book 863

Technology & Engineering

Currently unavailable to order

ISBN10: 1558998160
ISBN13: 9781558998162
Publisher: Cambridge
Published: Aug 26 2005
Pages: 411
Language: English
This book, first published in 2005, brings together leading modelers and experimentalists to discuss the plethora of process and reliability issues associated with depositing, characterizing and integrating novel and existing barriers, metals and ultralow-k dielectrics into reliable high-performance interconnects that can be robustly packaged. Section I focuses on low-k dielectric integration. Manuscripts highlight the importance of interface integrity and adhesion, the issue of process-induced dielectric damage and the need for pore sealing methods for low-k films. Channel cracking is addressed by several contributions. Cu metallization and barrier challenges are discussed in a section on metallization. Mechanical stress is highlighted in a reliability section. Contributions here provide a fundamental understanding of the issues of stress and stress relaxation in Cu films and lines encapsulated in low-k dielectrics. Presentations on electromigration, leakage and time-dependent dielectric breakdown, as well as thermal and mechanical fatigue, are also featured.

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