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Nanopackaging: Nanotechnologies and Electronics Packaging

Nanopackaging: Nanotechnologies and Electronics Packaging

Hardcover

Technology & Engineering

Currently unavailable to order

ISBN10: 0387473254
ISBN13: 9780387473253
Publisher: Springer
Published: Oct 23 2008
Pages: 543
Weight: 2.10
Height: 1.50 Width: 6.50 Depth: 9.40
Language: English

Nanotechnology is now being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement. This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. It is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

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