Open Daily: 10am - 10pm | Alley door pickup 10am - 7pm 3038 Hennepin Ave Minneapolis, MN
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  • Open Daily: 10am - 10pm
    Alley-side Pickup: 10am - 7pm

    3038 Hennepin Ave Minneapolis, MN
    612-822-4611

Open Daily: 10am - 10pm | Alley-side Pickup: 10am - 7pm
3038 Hennepin Ave Minneapolis, MN
612-822-4611
Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration

Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration

Yoshimura, Tetsuzo

Hardcover

Technology & EngineeringGeneral SciencePhysics

ISBN10: 9814877042
ISBN13: 9789814877046
Publisher: Jenny Stanford Publishing
Published: Mar 9 2021
Pages: 364
Weight: 1.49
Height: 0.88 Width: 6.00 Depth: 9.00
Language: English

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve short line distances of the cm-mm order and large line counts of hundreds-thousands. This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

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