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Materials for Electronic Packaging

Materials for Electronic Packaging

Hardcover

Technology & Engineering

Currently unavailable to order

ISBN10: 0750693142
ISBN13: 9780750693141
Publisher: Butterworth Heinemann
Published: Apr 5 1995
Pages: 368
Weight: 1.63
Height: 0.93 Width: 6.44 Depth: 9.57
Language: English

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Also from

Chung, Deborah D. L.

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Technology & Engineering