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Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Hardcover

Technology & Engineering

ISBN10: 0071785140
ISBN13: 9780071785143
Publisher: McGraw-Hill Companies
Published: Oct 11 2012
Pages: 512
Weight: 1.50
Height: 0.80 Width: 6.00 Depth: 9.30
Language: English
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.


A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

Also from

Lau, John H.

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Technology & Engineering